H3200ZE XIMADEN DCB relay

Description

H3200ZE High thermal conductivity DCB module relay directly sent to XIMADEN tempering furnace by Beijing Shimanton Company

1. Base plate material: DBC copper-ceramic bonding
2. Silicon wafer: glass passivated thyristor
3. Welding layer: two layers (low thermal resistance)
4. Internal protection material: high sealing and high soft silicone gel
5. Cleaning after welding: very clean
6. Thermal stability test (125 degrees) long-term stability
7. Leakage current test: Reverse leakage current < 10mA
8. Large current test: Good thermal matching and small deformation
9. Heat dissipation medium: patented thermal pad
10. Thermal pad application mark: Application of DBC and thermal pad